Socket LGA 3647 (Socket P) là chuẩn khe cắm mới cho dòng vi xử lý Intel, tương thích với bộ vi xử lý Xeon Phi x200 (Knights Landing), Skylake-EX và -EP (Xeon Purley). Socket này hỗ trợ bộ điều khiển bộ nhớ 6 kênh, bộ nhớ DIMM 3D XPoint, kết nối Intel UltraPath (UPI), thay thế cho QPI và kết nối Omni-Path 100G.
So với các thế hệ socket trước, thì socket 3647 có số chân nhiều hơn gần gấp đôi, vì thế mà kích thước của socket cũng lớn hơn kéo theo kích thước CPU dòng Intel Xeon Scalable cũng sẽ lớn hơn thế hệ Intel Xeon E3/E5/E7 trước đó. Mainboard Socket 3647 có số lượng socket tối thiểu là 1 socket, tối đa lên đến hơn 8 socket. Bộ vi xử lý Intel Xeon Scalable cũng được chia ra nhiều phân khúc tương đương với số socket được hỗ trợ: Bronze (2), Silver (2), Gold (4), Platinum (8+). Điều đặc biệt của dòng mainboard socket 3647 là cùng 1 socket có thể gắn được dòng chip thấp nhất là Bronze cho đến dòng cao nhất là Platinum, đúng như tên gọi của dòng này là Scalable (khả năng mở rộng). Vì thế, việc trang bị mainboard socket 3647 được sử dụng lâu dài cho khả năng mở rộng trong tương lại, giúp cho doanh nghiệp tiết kiệm được chi phí hơn vì không cần phải thay mainboard khi nâng cấp CPU từ dòng thấp lên dòng cao.
Form Factor: E-ATX, 12” x 13” (30.48cm x 33.02cm) Chipset: Intel® C621 Socket: Intel® Xeon® Scalable Processors. Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s Memory: Up to 2TB 3DS ECC RDIMM and DDR4-2666MHz, Up to 2TB 3DS ECC LRDIMM, in 16 DIMM slots
Form Factor: 12.3” x 13.4”, 12.3” x 13.4” (31.24cm x 34.04cm) Chipset: Intel® C621 Socket: Intel® Xeon® Scalable Processors. Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s Memory: Up to 1.5TB 3DS ECC RDIMM and DDR4-2666MHz, Up to 1.5TB 3DS ECC LRDIMM, in 12 DIMM slots
Form Factor: 12.3” x 13.4”, 12.3” x 13.4” (31.24cm x 34.04cm) Chipset: Intel® C622 Socket: Intel® Xeon® Scalable Processors. Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s Memory: Up to 1.5TB 3DS ECC RDIMM and DDR4-2666MHz, Up to 1.5TB 3DS ECC LRDIMM, in 12 DIMM slots
Form Factor: Proprietary, Chipset: Intel® C621 Socket: Intel® Xeon® Scalable Processors. Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 3 UPI up to 10.4 GT/s Memory: Up to 1.5TB 3DS ECC RDIMM and DDR4-2666MHz, Up to 1.5TB 3DS ECC LRDIMM, in 12 DIMM slots
Form Factor: Proprietary FatTwin, 6.8” x 19.436” (17.27cm x 49.37cm) Chipset: Intel® C621 Socket: Intel® Xeon® Scalable Processors. Dual Socket P (LGA 3647) supported, CPU TDP support 165W, 2 UPI up to 10.4 GT/s Memory: Up to 768GB Registered ECC RDIMM and DDR4- 2666MHz, Up to 1.5TB Registered ECC LRDIMM, in 12 DIMM slots"
Form Factor: Proprietary FatTwin, 6.8” x 19.436” (17.27cm x 49.37cm) Chipset: Intel® C621 Socket: Intel® Xeon® Scalable Processors. Dual Socket P (LGA 3647) supported, CPU TDP support 165W, 2 UPI up to 10.4 GT/s Memory: Up to 768GB Registered ECC RDIMM and DDR4- 2666MHz, Up to 1.5TB Registered ECC LRDIMM, in 12 DIMM slots"
Form Factor: Proprietary, 15.12” x 13.2” (38.4cm x 33.53cm) Chipset: Intel® C621 Socket: Intel® Xeon® Scalable Processors. Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 3 UPI up to 10.4 GT/s Memory: Up to 2TB 3DS ECC RDIMM and DDR4-2666MHz, Up to 2TB 3DS ECC LRDIMM, in 16 DIMM slots
Form Factor: E-ATX, Chipset: Intel® C622 Socket: Intel® Xeon® Scalable Processors. Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 3 UPI up to 10.4 GT/s Memory: Up to 1TB 3DS ECC RDIMM and DDR4-2666MHz, Up to 2TB 3DS ECC LRDIMM, in 16 DIMM slots
Form Factor: E-ATX, Chipset: Intel® C624 Socket: Intel® Xeon® Scalable Processors. Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 3 UPI up to 10.4 GT/s Memory: Up to 1TB 3DS ECC RDIMM and DDR4-2666MHz, Up to 2TB 3DS ECC LRDIMM, in 16 DIMM slots
Form Factor: E-ATX, Chipset: Intel® C626 Socket: Intel® Xeon® Scalable Processors. Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 3 UPI up to 10.4 GT/s Memory: Up to 1TB 3DS ECC RDIMM and DDR4-2666MHz, Up to 2TB 3DS ECC LRDIMM, in 16 DIMM slots
Form Factor: E-ATX, 12” x 13” (30.48cm x 33.02cm) Chipset: Intel® C621 Socket: Intel® Xeon® Scalable Processors. Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s Memory: Up to 2TB 3DS ECC RDIMM and DDR4-2666MHz, Up to 2TB 3DS ECC LRDIMM, in 16 DIMM slots
Form Factor: E-ATX, 12” x 13” (30.48cm x 33.02cm) Chipset: Intel® C622 Socket: Intel® Xeon® Scalable Processors. Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s Memory: Up to 2TB 3DS ECC RDIMM and DDR4-2666MHz, Up to 2TB 3DS ECC LRDIMM, in 16 DIMM slots
Form Factor: ATX, 12.076” x 10.15” (30.67cm x 25.78cm) Chipset: Intel® C621 Socket: Intel® Xeon® Scalable Processors. Dual Socket P (LGA 3647) supported, CPU TDP support Up to 140W, 2 UPI up to 10.4 GT/s Memory: Up to 512GB Registered ECC RDIMM and DDR4- 2666MHz, Up to 1TB Registered ECC LRDIMM, in 8 DIMM slots
Form Factor: Proprietary, 7.62” x 18.86” (19.35cm x 47.9cm) Chipset: Intel® C621 Socket: Intel® Xeon® Scalable Processors. Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s Memory: Up to 3TB 3DS ECC RDIMM and DDR4-2666MHz, Up to 3TB 3DS ECC LRDIMM, in 24 DIMM slots
Form Factor: Proprietary, 6.8” x 18.86” (17.27cm x 47.9cm) Chipset: Intel® C621 Socket: Intel® Xeon® Scalable Processors. Dual Socket P (LGA 3647) supported, CPU TDP support 165W TDP, 2 UPI up to 10.4 GT/s Memory: Up to 1TB Registered ECC RDIMM and DDR4-2666MHz, Up to 2TB 3DS ECC LRDIMM, in 16 DIMM slots
Form Factor: Proprietary Ultra/WIO, 17” x 16.8” (43.18cm x 42.67cm) Chipset: Intel® C621 Socket: Intel® Xeon® Scalable Processors. Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s Memory: Up to 3TB 3DS ECC RDIMM and DDR4-2666MHz, Up to 3TB 3DS ECC LRDIMM, in 24 DIMM slots
Form Factor: Proprietary Ultra/WIO, 17” x 16.8” (43.18cm x 42.67cm) Chipset: Intel® C621 Socket: Intel® Xeon® Scalable Processors. Dual Socket P (LGA 3647) supported, CPU TDP support Up to 255W, 2 UPI up to 10.4 GT/s Memory: Up to 2TB 3DS ECC RDIMM and DDR4-2666MHz, Up to 2TB 3DS ECC LRDIMM, in 16 DIMM slots
Form Factor: Proprietary Ultra/WIO, 17” x 16.8” (43.18cm x 42.67cm) Chipset: Intel® C621 Socket: Intel® Xeon® Scalable Processors. Dual Socket P (LGA 3647) supported, 2 UPI up to 10.4 GT/s Memory: Up to 2TB 3DS ECC RDIMM and DDR4-2666MHz, Up to 2TB 3DS ECC LRDIMM, in 16 DIMM slots
Form Factor: Proprietary Ultra/WIO, 17” x 16.8” (43.18cm x 42.67cm) Chipset: Intel® C621 Socket: Intel® Xeon® Scalable Processors. Dual Socket P (LGA 3647) supported, CPU TDP support Up to 255W, 3 UPI up to 10.4 GT/s Memory: Up to 3TB 3DS ECC RDIMM and DDR4-2666MHz, Up to 3TB 3DS ECC LRDIMM, in 24 DIMM slots
Form Factor: Proprietary, 15.12” x 13.2” (38.4cm x 33.53cm) Chipset: Intel® C621 Socket: Intel® Xeon® Scalable Processors. Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 3 UPI up to 10.4 GT/s Memory: Up to 2TB 3DS ECC RDIMM and DDR4-2666MHz, Up to 2TB 3DS ECC LRDIMM, in 16 DIMM slots
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