Form Factor: E-ATX, 12” x 13” (30.48cm x 33.02cm) Chipset: Intel® C621 Socket: Intel® Xeon® Scalable Processors. Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s Memory: Up to 2TB 3DS ECC RDIMM and DDR4-2666MHz, Up to 2TB 3DS ECC LRDIMM, in 16 DIMM slots
Form Factor: 12.3” x 13.4”, 12.3” x 13.4” (31.24cm x 34.04cm) Chipset: Intel® C621 Socket: Intel® Xeon® Scalable Processors. Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s Memory: Up to 1.5TB 3DS ECC RDIMM and DDR4-2666MHz, Up to 1.5TB 3DS ECC LRDIMM, in 12 DIMM slots
Form Factor: 12.3” x 13.4”, 12.3” x 13.4” (31.24cm x 34.04cm) Chipset: Intel® C622 Socket: Intel® Xeon® Scalable Processors. Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s Memory: Up to 1.5TB 3DS ECC RDIMM and DDR4-2666MHz, Up to 1.5TB 3DS ECC LRDIMM, in 12 DIMM slots
Form Factor: Proprietary, Chipset: Intel® C621 Socket: Intel® Xeon® Scalable Processors. Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 3 UPI up to 10.4 GT/s Memory: Up to 1.5TB 3DS ECC RDIMM and DDR4-2666MHz, Up to 1.5TB 3DS ECC LRDIMM, in 12 DIMM slots
Form Factor: Proprietary FatTwin, 6.8” x 19.436” (17.27cm x 49.37cm) Chipset: Intel® C621 Socket: Intel® Xeon® Scalable Processors. Dual Socket P (LGA 3647) supported, CPU TDP support 165W, 2 UPI up to 10.4 GT/s Memory: Up to 768GB Registered ECC RDIMM and DDR4- 2666MHz, Up to 1.5TB Registered ECC LRDIMM, in 12 DIMM slots"
Form Factor: Proprietary FatTwin, 6.8” x 19.436” (17.27cm x 49.37cm) Chipset: Intel® C621 Socket: Intel® Xeon® Scalable Processors. Dual Socket P (LGA 3647) supported, CPU TDP support 165W, 2 UPI up to 10.4 GT/s Memory: Up to 768GB Registered ECC RDIMM and DDR4- 2666MHz, Up to 1.5TB Registered ECC LRDIMM, in 12 DIMM slots"
Form Factor: Proprietary, 15.12” x 13.2” (38.4cm x 33.53cm) Chipset: Intel® C621 Socket: Intel® Xeon® Scalable Processors. Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 3 UPI up to 10.4 GT/s Memory: Up to 2TB 3DS ECC RDIMM and DDR4-2666MHz, Up to 2TB 3DS ECC LRDIMM, in 16 DIMM slots
Form Factor: E-ATX, Chipset: Intel® C622 Socket: Intel® Xeon® Scalable Processors. Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 3 UPI up to 10.4 GT/s Memory: Up to 1TB 3DS ECC RDIMM and DDR4-2666MHz, Up to 2TB 3DS ECC LRDIMM, in 16 DIMM slots
Form Factor: E-ATX, Chipset: Intel® C624 Socket: Intel® Xeon® Scalable Processors. Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 3 UPI up to 10.4 GT/s Memory: Up to 1TB 3DS ECC RDIMM and DDR4-2666MHz, Up to 2TB 3DS ECC LRDIMM, in 16 DIMM slots
Form Factor: E-ATX, Chipset: Intel® C626 Socket: Intel® Xeon® Scalable Processors. Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 3 UPI up to 10.4 GT/s Memory: Up to 1TB 3DS ECC RDIMM and DDR4-2666MHz, Up to 2TB 3DS ECC LRDIMM, in 16 DIMM slots
Form Factor: E-ATX, 12” x 13” (30.48cm x 33.02cm) Chipset: Intel® C621 Socket: Intel® Xeon® Scalable Processors. Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s Memory: Up to 2TB 3DS ECC RDIMM and DDR4-2666MHz, Up to 2TB 3DS ECC LRDIMM, in 16 DIMM slots
Form Factor: E-ATX, 12” x 13” (30.48cm x 33.02cm) Chipset: Intel® C622 Socket: Intel® Xeon® Scalable Processors. Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s Memory: Up to 2TB 3DS ECC RDIMM and DDR4-2666MHz, Up to 2TB 3DS ECC LRDIMM, in 16 DIMM slots
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