Form Factor: microATX, 9.6” x 9.6” (24.38cm x 24.38cm) Chipset: Intel® C621 Socket: Intel® Xeon® Scalable Processors. Single Socket P (LGA 3647) supported, CPU TDP support 165W Memory: 6x 288-pin DDR4 DIMM slots Up to 768GB ECC 3DS LRDIMM Up to 384GB ECC LRDIMM Up to 192GB ECC RDIMM"
Form Factor: microATX, 9.6” x 9.6” (24.38cm x 24.38cm) Chipset: Intel® C622 Socket: Intel® Xeon® Scalable Processors. Single Socket P (LGA 3647) supported, CPU TDP support 165W Memory: 6x 288-pin DDR4 DIMM slots Up to 768GB ECC 3DS LRDIMM Up to 384GB ECC LRDIMM Up to 192GB ECC RDIMM
Form Factor: microATX, 9.6” x 9.6” (24.38cm x 24.38cm) Chipset: Intel® C622 Socket: Intel® Xeon® Scalable Processors. Single Socket P (LGA 3647) supported, CPU TDP support 165W Memory: 6x 288-pin DDR4 DIMM slots Up to 768GB ECC 3DS LRDIMM Up to 384GB ECC LRDIMM Up to 192GB ECC RDIMM
Form Factor: Proprietary WIO, 8” x 13” (20.32cm x 33.02cm) Chipset: Intel® C622 Socket: Intel® Xeon® Scalable Processors. Single Socket P (LGA 3647) supported, CPU TDP support 205W Memory: 6x 288-pin DDR4 DIMM slots Up to 768GB ECC 3DS LRDIMM Up to 384GB ECC LRDIMM Up to 192GB ECC RDIMM"
Form Factor: Proprietary WIO, 8” x 13” (20.32cm x 33.02cm) Chipset: Intel® C622 Socket: Intel® Xeon® Scalable Processors. Single Socket P (LGA 3647) supported, CPU TDP support 205W Memory: 6x 288-pin DDR4 DIMM slots Up to 768GB ECC 3DS LRDIMM Up to 384GB ECC LRDIMM Up to 192GB ECC RDIMM"
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